Precision PCB Assembly from Prototype to Production
ISO 9001:2015-driven processes, high-speed SMT lines, and strict quality control to bring your electronics to life with reliability, repeatability, and scale.
ISO 9001:2015 processes with IPC-trained operators on every SMT and THT line.
Dedicated lanes for NPI, quick-turn prototypes, and high-volume production programs.
SPECIFICATIONS
Technical Capabilities
Our manufacturing lines are configured to handle a wide range of complex requirements, from prototype agility to production volume.
WHAT WE DO
End-to-End PCB Assembly Services
From single-layer to complex multi-layer boards with fine-pitch BGAs, our lines are tuned to handle both prototype volumes and production runs at scale.
IPC-certified engineers and operators monitor every step—from paste printing and placement to reflow, inspection, and testing— so each board meets your reliability targets.
INDUSTRY FOCUS
PCB Assemblies for Critical Applications
We support customers across regulated, safety-critical, and high-reliability domains with documented, traceable processes.
Automotive
AEC-Q200 compliant assemblies for automotive electronics.
Medical Devices
Support for ISO 13485 flows for medical electronics.
Industrial IoT
Rugged designs for harsh industrial environments.
Consumer Electronics
High-volume, cost-optimized consumer electronics builds.
Telecommunications
High-reliability assemblies for telecom infrastructure.
Aerospace & Defense
Stringent process controls for mission-critical systems.
Maximize Yield, Minimize Total Cost
We leverage DFM reviews, BOM engineering, and lean manufacturing to reduce your landed cost without compromising on reliability or performance.
DFM and DFA input during early design stages.
Bulk and alternate-component sourcing strategies.
Lean production scheduling to reduce changeover time.
Scrap and rework reduction through in-line checks.
Flexible volume-based commercial models.
HOW WE WORK
A Structured 6-Step Assembly Process
Each stage has defined inputs, outputs, and quality checks.
Design Review
Comprehensive DFM analysis for manufacturability.
Material Procurement
Sourcing components from verified global suppliers.
SMT Assembly
Automated pick-and-place with precise solder paste.
Reflow Soldering
Controlled profiles for reliable solder joints.
Inspection & Testing
AOI, X-ray, and functional testing for QA.
Delivery
Secure packaging and on-time global shipment.
EQUIPMENT
Advanced Technology on the Line
Modern SMT, inspection, and thermal systems ensure repeatable, measurable quality.
High-Speed SMT Lines
Latest generation pick-and-place machines with 0201 component capability.
X-Ray Inspection
Advanced X-ray systems for BGA and hidden solder joint inspection.
3D AOI Systems
3D automated optical inspection for comprehensive quality control.
Reflow Ovens
Precision reflow ovens with nitrogen atmosphere for perfect joints.
SERVICE MENU
Built Around Your Assembly Needs
Mix and match services from prototyping through full-box builds.
Surface Mount Technology (SMT)
High-speed automated SMT assembly with precision placement for complex boards.
Through-Hole Assembly
Traditional through-hole assembly for components requiring mechanical strength.
Mixed Technology Assembly
Combining SMT and through-hole techniques for optimal board design.
BGA and Micro-BGA Assembly
Advanced ball grid array assembly with X-ray inspection.
Lead-Free & RoHS Compliant
Environmentally friendly assembly meeting global compliance standards.
Automated Optical Inspection (AOI)
State-of-the-art AOI systems ensuring zero-defect manufacturing.
Rigorous Quality Control, End-to-End
Multiple checkpoints ensure that every assembly leaving the line is fully inspected, validated, and ready for integration into your product.
Incoming component inspection and verification.
In-process AOI and X-ray for hidden joints.
Functional testing, burn-in, and custom test jigs.
Final visual inspection and ESD-safe packaging.